JPH0381630U - - Google Patents

Info

Publication number
JPH0381630U
JPH0381630U JP14335789U JP14335789U JPH0381630U JP H0381630 U JPH0381630 U JP H0381630U JP 14335789 U JP14335789 U JP 14335789U JP 14335789 U JP14335789 U JP 14335789U JP H0381630 U JPH0381630 U JP H0381630U
Authority
JP
Japan
Prior art keywords
pin
metal substrate
outer pin
mounter
stirring rod
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14335789U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP14335789U priority Critical patent/JPH0381630U/ja
Publication of JPH0381630U publication Critical patent/JPH0381630U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743Apparatus for manufacturing layer connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP14335789U 1989-12-11 1989-12-11 Pending JPH0381630U (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14335789U JPH0381630U (en]) 1989-12-11 1989-12-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14335789U JPH0381630U (en]) 1989-12-11 1989-12-11

Publications (1)

Publication Number Publication Date
JPH0381630U true JPH0381630U (en]) 1991-08-21

Family

ID=31690133

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14335789U Pending JPH0381630U (en]) 1989-12-11 1989-12-11

Country Status (1)

Country Link
JP (1) JPH0381630U (en])

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